Electron device with ring-less getter, method for affixing ring-less getter, and method for activating the same

ABSTRACT

An electron device such as a fluorescent display tube is provided, wherein a simple ring-less getter can be simply fixed and arranged with a large degree of freedom. The ring-less getter is securely fixed to the inner surface of the glass anode substrate using laser beams. The laser beam is irradiated onto the ring-less getter from outside the anode substrate. Thus, the laser beam passes through the anode substrate thus heating and melting the ring-less getter. The corresponding inner surface of the anode substrate is melted through the heating. In cooling, the portion where the ring-less getter and the anode substrate are in a molten state is solidified, so that the ring-less getter is bonded to the anode substrate. The ring-less getter is shaped arbitrarily through press-working a getter material.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to International Patent ApplicationPCT/JP03/05772, filed 08 May 2003, which claims priority of JPapplication 2002-136338 filed 10 May 2002.

TECHNICAL FIELD

The present invention relates to electron devices with ring-lessgetters, suitable in use for electron tubes (such as fluorescent displaytubes, CRTs, Plasma Display Panels (PDPs), and the like) andelectroluminescent displays (ELDs). Moreover, the present inventionrelates to a method for fixing a ring-less getter and a method foractivating the same.

BACKGROUND

In electron devices, such as electron tubes and ELDs, the hermeticcontainer contains a getter. The getter is heated and activated byilluminating radio waves or laser beams from the outside. Thus, thegetter adsorbs gases or moisture within the envelope or emits specificgases. For example, when the electron tube belongs to a vacuum tube, thegetter adsorbs gases existing in the envelope, thus increasing thedegree of vacuum. When the electron tube belongs to a discharge tube,the getter adsorbs unnecessary gas or harmful gas, other than adischarging gas having xenon or neon as a principal constituent,introduced in the envelope. In the case of ELDs, the getter adsorbsmoisture within the hermetic container to prolong the serviceable life.

A fluorescent display tube, in which a conventional getter is mounted,will be explained below by referring to FIGS. 7 and 8. In FIGS. 7 and 8,like numerals are attached to the common constituent elements.

FIG. 7 is a cross-sectional view illustrating a fluorescent display tubein which a conventional ring getter is mounted.

FIG. 7( a) is a cross-sectional view illustrating the portion takenalong the line Y2-Y2 in FIG. 7( b). FIG. 7( b) is a cross-sectional viewillustrating the portion taken along the line Y1-Y1 in FIG. 7 (a) .Anode electrodes 55, each on which a fluorescent substance is coated,are formed on a glass substrate 511. The mounting member 52 of theholder member (anchor or support) 531 for cathode filaments 532 isformed on a glass substrate 511. A ring container 541, which is filledwith a getter material 542, is welded to the getter holder member 543.Grids 56 are disposed between each anode electrode 55 and the filaments532. Numeral 512 represents a glass front substrate. Each of numerals513 to 515 represents a glass side plate. Anode wiring conductors, Nesafilms on the front substrate, and others are omitted here.

The ring container 541, being an nickel-plated iron envelope, is filledwith a getter material 542, made of a mixture of Ba, Ma, or an alloy ofthem and an additive metal (such as Al or Ni).

In order to activate the ring getter 54, the ring container 541 isheated through the high-frequency induction heating from outside thefluorescent display tube to flush (evaporating) the getter material 542.The particles of the evaporated getter material 542 make a getter mirrorfilm over an inner surface of the front substrate 543.

The ring getter 54, having a special ring container 541 and a specialholder member 543, is difficult to be miniaturized and requires a largemounting space. The ring getter container 541 has to be spaced at least1 mm from the anode substrate 511 because the anode substrate 511 may becracked during heating. This makes it difficult to miniaturize and thinthe fluorescent display tube. Moreover, both the ring container 541 andthe holder member 543 lead to higher machining costs. The difficult workfor mounting them increases the fabrication cost of the fluorescentdisplay tube.

The mounting place of the ring getter 54 is limited to the metalcomponent such as the mounting member 52. Hence, there is no degree offreedom in the arrangement of the ring getter 54.

In order to improve the drawback of the ring getter shown in FIG. 7, thering getter shown in FIG. 8, which does not use the special ringcontainer or the special holder member, has been proposed.

Referring to FIG. 8( a), a ring-less getter 54 is formed of an pocket(or a recess), which is filled with a getter material, in the innersurface of the front substrate 512 (refer to Japanese Patent Laid-openPublication No. Tokkai-Hei 5-114373). In this example, the pocket formedin the front substrate 512 leads to the high machining cost. However,the ring-less getter is filled with a necessary amount of gettermaterial enough to provide a getter effect because a deep pocket cannotbe made sufficiently.

Referring to FIG. 8( b), using the screen printing or vacuum deposition,the film ring-less getter 54, made of a thick or thick film gettermaterial, is formed in the inner surface of the front substrate 512(refer to Patent Publication No. WO93/16484). In this example, the thickor thin ring-less getter 54 cannot hold a necessary amount of gettermaterial to provide a sufficient getter effect.

The ring-less getter 54 of FIG. 8( c) may be considered in place of thering-less getter of FIGS. 8( a) and 8(b). In the ring-less getter 54shown in FIG. 8( c), the getter material is sintered in the form of adisc of a diameter of 2 mm and a thickness of 0.5 mm. The ring-lessgetter 54 is attached to the inner surface of the front substrate 512with the fritted glass 57. In this example, the ring-less getter 54having a large thickness can hold a sufficient amount of gettermaterial. However, because the adhesive strength, particularly, theadhesive strength between the ring-less getter and the fritted glass, isnot strong (the shear strength is less than 1 N), the ring-less getter54 may be dropped down during the fabrication process of the fluorescentdisplay tube.

Because the getter material deteriorates at high sintering temperatures(for example, BaAl4 is oxidized), the fritted glass for adhesion issintered at a low sintering temperature (for example, less than 450° C.)in the atmosphere. However, the low sintering temperature causes theresidue of an organic constituent (for example, ethyl cellulose) in thefritted glass paste, thus resulting in deterioration of the reliabilityof the fluorescent display tube. Moreover, in order to flush thering-less getter 54 with the laser beam, the laser beam reaching thefritted glass 57 releases a large amount of gases, so that the emissionof the filament 532 is degraded remarkably.

The present invention is made to solve the above-mentioned problems inthe conventional ring getters and the conventional ring-less getters.

An object of the invention is to provide an electron device with aring-less getter. The ring-less getter has a simple configuration and adegree of freedom in arrangement. Moreover, the ring-less getter iseasily mountable and is suitable for miniaturization and thinning ofelectron devices, such as electron tubes or ELDs. Moreover, thering-less getter does not cause cracking of a glass substrate due toheating during mounting or during flushing and does not generate gasesdeteriorating the function of an electron tube.

Moreover, another object of the invention is to provide a method forfixing a ring-getter and a method for activating the same.

SUMMARY

In an aspect of the present invention, an electron device comprises aglass substrate disposed in a hermetic container, and a ring-less getterbonded onto the glass substrate, with an optical energy.

In another aspect of the present invention, an electron device comprisesa glass substrate disposed in a hermetic container, a ring-less getterbonded onto the glass substrate, with an optical energy, and a gettermirror film formed by activating the ring-less getter bonded with anoptical energy.

In the electron device, the optical energy is a laser beam.

In the electron device, the glass substrate builds part of the hermeticcontainer.

In the electron device, the ring-less getter is made throughpress-working a getter material powder.

In another aspect of the present invention, an electron device comprisesa resin hermetic container, and a ring-less getter bonded onto an innersurface of the resin hermetic container, with an optical energy.

In further another aspect of the present invention, a method for fixinga ring-less getter, comprises the steps of disposing a ring-less getteron a glass substrate in an electron device, irradiating an opticalenergy onto the ring-less getter from a surface of the glass substrate,opposite to a surface of the glass substrate on which the ring-lessgetter is disposed, and bonding the ring-less getter on the glasssubstrate.

In the method, the optical energy is a laser beam. In still anotheraspect of the invention, a method for activating a ring-less getter,comprises the steps of disposing a ring-less getter on a glass substratein an electron device, irradiating an optical energy onto the ring-lessgetter from a surface of the glass substrate, opposite to a surface ofthe glass substrate on which the ring-less getter is disposed, bondingthe ring-less getter on the glass substrate, and irradiating an opticalenergy the ring-less getter to activate the ring-less getter.

In the method, the optical energy is a laser beam.

BRIEF DESCRIPTION OF THE DRAWINGS

This and other objects, features, and advantages of the presentinvention will become more apparent upon a reading of the followingdetailed description and drawings, in which:

FIGS. 1( a) and 1(b) are cross-sectional views, each illustrating afluorescent display tube according to a first embodiment of the presentinvention;

FIGS. 2( a) and 2(b) are cross-sectional views, each illustrating afluorescent display tube according to a second embodiment of the presentinvention;

FIG. 3 is a cross-sectional view illustrating a fluorescent display tubeaccording to a third embodiment of the present invention;

FIG. 4 is a cross-sectional view illustrating a fluorescent display tubeaccording to a fourth embodiment of the present invention;

FIGS. 5( a), 5(c), 5(d), and 5(e) are plan views, each illustrating aring-less getter according to an embodiment of the present invention andFIGS. 5( b) and 5(f) are cross-sectional views, each illustrating aring-less getter according to an embodiment of the present invention;

FIGS. 6( a), 6(b) and 6(c) are diagrams, each explaining a method forfixing a ring-less getter according to an embodiment of the presentinvention and a method for flushing the same;

FIGS. 7( a) and 7(b), are cross-sectional views, each illustrating afluorescent display tube with a conventional ring getter therein; and

FIGS. 8( a), 8(b) and 8(c) are cross-sectional views, each illustratinga fluorescent display tube with a conventional ring-less getter therein.

DETAILED DESCRIPTION

A fluorescent display tube (being one of electron devices), a ring-lessgetter fixing method, and a ring-less getter activating method,according to an embodiment of the present invention, will be describedbelow by referring to FIGS. 1 to 6. Like numerals are attached to thesame constituent elements.

FIG. 1 is a cross-sectional view illustrating a fluorescent display tubeaccording to a first embodiment of the present invention. FIG. 1( a) isa cross-sectional view illustrating a portion taken along the line X2-X2in the arrow direction, shown in FIG. 1( b). FIG. 1( b) is across-sectional view illustrating a portion taken along the line X1-X1in the arrow direction, shown in FIG. 1( a).

Referring to FIG. 1( a), numeral 111 represents a glass substrate, 112represents a glass front substrate, and 113 to 115 represent a glassside plate, and 12 represents a mounting member of a filament holdermember (anchor or support) formed of a metal plate. Numeral 131represents a filament holder member formed of a metal member such as 426alloy (Ni of 45%, Cr of 6%, Fe (remainder)). Numeral 132 represents acathode filament, which is formed of W or Re—W core on which an electronemissive material such as ternary carbonate is coated. Numeral 15represents an anode electrode formed of a metal film such as aluminum onwhich a fluorescent substance such as ZnO:Zn is coated. Numeral 16represents a grid, which is formed of a stainless steel or 426 alloydisposed between the filament 132 and the anode electrode 15. Each ofnumerals G11 to G13 represents a ring-less getter.

The ring-less getter, G11 to G13, is made through press molding a mixedpowder of powder such as BaAl4 and MgAl, or a mixed powder of BaAl₄ andMgAl and an additive metal (such as Ni, Ti, or Fe).

An envelope, or a hermetic container, of a fluorescent display tube isbuilt with the anode substrate 111, the front substrate 112 and the sideplates 113 to 115. When the side plates are integrally made in abox-like form with the anode substrate 111 or the front substrate 112,the side plates can be omitted.

The ring-less getters G11 to G13 are bonded directly to the innersurface of the anode substrate 111 by means of the laser beamilluminated from outside the anode substrate, without using adhesivemeans such as an adhesive agent, (as described later) . When thering-less getters G11 to G13 are selected in size, a single ring-lessgetter or plural ring-less getters may be used. The number of ring-lessgetters G11 to G13 depends on the total amount of the getter materialneeded for adsorbing gases generated in the fluorescent display tube andhence is selected according to the amount of gas.

The ring-less getter, G11 to G13, can be press molded in a given shape.By preparing plural ring-less getters corresponding to the form of thedead space of the anode substrate 111, the dead space can be effectivelyutilized as a ring-less getter fixing place.

FIG. 2( a) shows an example where the ring-less getter G14, G15 is fixedon the surface of the front substrate 112. FIG. 2( b) shows an examplewhere the ring-less getter G16 is fixed on the surface of the side plate114. The arrangement of FIG. 2( a) and the arrangement of FIG. 2( b) maybe combined together. That is, in a single fluorescent display tube, thering-less getter G14, G15 can be fixed on the inner surface of the frontsubstrate 112 and the ring-less getter G16 can be fixed on the sideplate 114.

FIG. 3 is a cross-sectional view illustrating a fluorescent display tubeaccording to the third embodiment of the present invention.

Referring to FIG. 3, each filament 132 is suspended above the frontsubstrate 112 and the ring-less getter G17 is attached to the glassintermediate substrate 116.

The intermediate substrate 116, acting as a member for holding the grid16, has openings 117 through which electrons emitted from the filament132 can pass to the anode electrode 15. The intermediate substrate 116may be used as an intermediate partition member in the envelope (or ahermetic container) of a fluorescent display tube.

The ends of each filament 132 are ultrasonically bonded to the metallayer (film), e.g., aluminum, acting as an anode mounting electrodeformed on the front substrate 112. That is, each end of the filament 132is sandwiched between the metal layer 133 and the metal piece 134 andthe metal piece 134 is bonded to the metal layer 133 through theultrasonic welding (including diffusion welding, friction welding, orsolid phase junction). The spacer 135, such as an aluminum thin wire ora glass fiber, maintains the filament 132 in a predetermined height.

The ring-less getter G17 in FIG. 3 is bonded to one surface of theintermediate substrate 116 but may be bonded on both surfaces thereof.In such case, the ring-less getters are disposed on both surfaces insuch a way that they are not overlapped.

FIG. 4 is a cross-sectional view illustrating a fluorescent display tubeaccording to the fourth embodiment of the present invention. Referringto FIG. 4, the ring-less getter G18 is bonded directly to the anodewiring conductor 151 (formed of a metal film such as aluminum) formedover the anode substrate 111, without intervening an insulating layer ofSiO2 or SiN. Here, the anode wiring conductor means a conductorconnected to an anode electrode and acting as a power supply pointexternally derived from the fluorescent display tube. (This isapplicable to the cathode wiring conductor and the grid wiringconductor.) In this case, even if the anode wiring conductor 151 isfused during the bonding of the ring-less getter G18, the anode wiringconductor 151 does not disconnect at the ring-less getter G18 becausethe ring-less getter G18 is metal. The ring-less getter G18 flushes withthe laser beam irradiated after the sealing of the fluorescent displaytube (as described later). However, since the flushing does not causethe evaporation of all the ring-less getter G18, the anode wiringconductor 151 does not break down.

In the present embodiment, bonding the ring-less getter on the anodewiring conductor can make larger the degree of freedom in arrangement ofa ring-less getter.

Similarly, that feature is applicable the case where the cathode wiringconductor, connected to the cathode electrode, formed on the cathodesubstrate (the front substrate) or the grid wiring conductor connectedto the grid.

FIG. 5 is a plan view or a cross-sectional view illustrating a ring-lessgetter according to an embodiment of the present invention.

Each of FIGS. 5( a) and 5(b) shows the ring-less getter G21 press-moldedin a rectangular shape. FIG. 5( b) is a cross-sectional viewillustrating the portion taken along the line of X3-X3 FIG. 5( a).

FIG. 5( c) shows the ring-less getter G22 press-molded in a disc shape.FIG. 5(d) shows the ring-less getter G23 press-molded in a doughnutshape.

Each of FIGS. 5( e) and 5(f) shows the ring-less getter G24 press-moldedin a rectangular shape. FIG. 5( f) is a cross-sectional viewillustrating the portion taken along the line X4-X4 of FIG. 5( e). Thering-less getter 24 is made of a getter material layer G241 and a metallayer G242, which is formed of a metal plate or a metal material layersuch as aluminum. The ring-less getter is formed by integrallypress-molding the getter material and the metal plate. The ring-lessgetter 24 is bonded with the meal layer G242 fixed to the fixing surfaceof the anode substrate. Indium, tin or its alloy, 426 alloy, aluminum,or the like may be used for the metal layer G242.

Compared with the case where only the getter material layer G241 isused, the ring-less getter 24 with the metal layer G242 is hard to bebrittle and facilitates the work of bonding the ring-less getter G24.

The ring-less getter in FIG. 5 has an exemplary shape but may be formedin another shape. Plural ring-less getters, corresponding to the form ofthe getter mounting place, may be mounted in the fluorescent displaytube. Thus, the dead spaces in the fluorescent display tube can beeffectively utilized.

FIG. 6 is a diagram explaining a ring-less getter fixing method and aring-less getter flush activating method, each according to anembodiment of the present invention.

As shown in FIG. 6( a), a laser beam L1 is irradiated onto the ring-lessgetter G11 disposed on the inner surface of the anode substrate 111 fromoutside the anode substrate 111. There are a method of temporarilymounting a ring-less getter G11 with a low-temperature degradableadhesive agent such as acrylic and a method of mechanically cramping aring-less getter and then pressing it to the anode substrate. The laserbeam L1 impinges on the ring-less getter G11 through the anode substrate111, without substantial absorption. The ring-less getter G1 is heatedand fused with the laser beam L1. The laser beam L1 passing through theanode substrate 111 does not heat the anode substrate 111. However, theanode substrate 111 is heated through the heating of the ring-lessgetter G11. Thus, the portion of the anode substrate 111, which is incontact with the ring-less getter G11, melts. In such a state, both thering-less getter G11 and the anode substrate 11 are cooled, the moltenportions thereof are solidified so that the ring-less getter G11 issecurely fixed to the anode substrate 111.

A conventional getter material may be used for the ring-less getter G11.However, when a mixture of BaAl4, MaAl and Ni, Ti, Fe are used, itreacts chemically with Al, Ni, so that the reaction heat generates.Since the reaction heat increases the ring-less getter G11 to atemperature of 1050° C., the inner surface of the anode substrate 111(which is in contact with the ring-less getter G11) fuses rapidly. Thering-less getter material having a low transmittance (other than totaltransmission) of a laser beam, that is, an optical energy, is suitablyselected.

The inventor of this application focused an attention on the fact thatas the laser beam L1 heats the ring-less getter G11 through the glassanode substrate 111, the anode substrate 111 thermally melts through theheating of the ring-less getter G11. Thus, the present inventor inventedthe method of bonding the ring-less getter G11 to the anode substrate111 through the irradiation of the laser beam L1.

The laser beam L1 may be illuminated through the laser marker system orthe dot spot system. The laser may be YAG laser, excimer laser, carbondioxide laser, or the like.

The glass substrate can pass wavelengths ranging from visible rays to1.06 μm used with the YAG laser. Particularly, the glass substrateindicating a high transmittance of 1.06 μm is effective for the YAGlaser.

The present embodiment uses a disc ring-less getter having a diameter of2 mm and a thickness of 0.5 mm and a flat ring-less getter having a sizeof 2 mm×10 mm and a thickness of 0.5 mm. The ring-less getter is fixedto a 1.1 mm-thick soda glass substrate. A non-alkali glass may be usedfor the glass substrate.

In the laser marker system, a YAG laser is used and 17 W, 10 kH, and 20mm/second are set for the laser beam conditions.

In the laser marker system, the adhesive strength (or the shearstrength) of the disc ring-less getter is 20 N and the adhesive strengthof the flat ring-less getter is 60 N or more. With the same size and thesame conditions, the adhesive strength in the laser marker system wasimproved 20 times, compared with the adhesive strength of the ring-lessgetter bonded with the fritted glass. Here, the shear strength means theforce of peeling off the ring-less getter from the anode substrate whena force is applied from the side surface thereof to a ring-less getterbonded on the anode substrate in the direction in parallel with theanode substrate. In other words, the shear strength means a maximumforce for peeling off a ring-less getter.

As shown in FIG. 6( b), after the ring-less getter G11 is bonded to theanode substrate 111, a fluorescent display tube is assembled through theconventional assembly process and then is evacuated for sealing.

As shown in FIG. 6( c), the laser beam L2 is irradiated onto thering-less getter G11 from the outside the front substrate, that is, fromthe outside of the envelope (or hermetic container) of the fluorescentdisplay tube. Thus, the ring-less getter G11 activates (flushes) and theparticles of the evaporated (flushed) getter material sputter in thedirection of the arrow F. As a result, a getter mirror film (not shown)is formed over an inner surface of the front substrate 112, that is,over an inner surface of the envelope of the fluorescent display tube.The laser beam L2 may impinge onto the side surface of the ring-lessgetter G11 from the outside of the side plate 114 so that the gettermirror film of Ba can be formed over an inner surface of the side plate114.

With the illumination conditions of 8 W, 5 kH, and 100 mm/second, thelaser beam is irradiated according to the laser marker system.

In the above-mentioned embodiments, the example has been explained wherethe ring-less getter is bonded to the anode substrate, the frontsubstrate, the side plate, or the grid holding intermediate substrate.However, the member for fixing the ring-less getter is not limited onlyto the above-embodiments. The ring-less getter can be fixed with theglass member disposed in the envelope of a fluorescent display tube, forexample, with a glass pillar (support or spacer) or a glass plate whichcan prevent an evaporated getter material from being sputtered towardthe display surface, the electrodes, or others. In the presentinvention, a glass member for fixing the ring-less getter is called aglass substrate.

In each above-mentioned embodiment, the example has been explained wherea ring-less getter is fixed to each glass substrate. However, thering-less getter may be fixed to plural glass substrates. The glasssubstrate, on which a ring-less getter is fixed, as well as the locationfor fixing may be suitably selected according to the configuration of afluorescent display tube.

The example of bonding and flushing the ring-less getter with the laserbeam has been explained. However, an optical energy, except laser beam,may be used.

In each embodiment, the evaporation-type getter has been explained.However, a non-evaporation-type getter containing a main constituentsuch as Zr, Ti, Ta, and the like may be employed. Thenon-evaporation-type getter is heated to an activation temperature,without flushing, to provide the gas adsorption capability. However, anoptical energy may be used to heat the non-evaporation-type getter.

In each embodiment, a fluorescent display tube has been explained.However, field emission fluorescent displays, luminous tubes forlarge-screen display devices, luminous tubes for fluorescent printheads, electron tube, such as CRTs, belonging to vacuum tubes, electrontubes, such as PDPs, belonging to discharge tubes, or electron devicessuch as ELDs may be used in each embodiment. When the electron device iseither an electron tube belonging to a discharge tube or an ELD, anon-evaporation type ring-less getter is used. The PDP employs a gettermaterial that can adsorb nitrogen and oxygen. The FED, particularly, anorganic FED uses a getter material that can adsorb moisture. In theorganic FED, organic luminous elements each having a first electrode, anorganic layer including a luminous layer formed on the first electrode,and a second electrode formed on the organic layer, are contained in ahermetic container. Moreover, in the FED, the hermetic container isformed of a resin such as plastic or polymer film. When the resin istransparent or is transparent to an optical energy, the ring-less gettercan be bonded onto the inner surface of the hermetic container with theoptical energy, without heating the resin.

In each embodiment, the case where has been described all substratesincluding an anode substrate, a front substrate, a side plate, or a gridholding intermediate substrate are made of glass. However, it is notalways required that all the substrates are made of glass. It is merelyrequired that the substrate to which the ring-less getter is bonded isat least of glass. Alternatively, it is merely requires that the portionof a substrate at which a ring-less getter is bonded is at least ofglass.

Similarly, when the ring-less getter is activated, all portions or partof a substrate confronting the ring-less getter (or of a substrateallows which the passing of an optical energy irradiated to a ring-lessgetter) may be of glass.

INDUSTRIAL APPLICABILITY

The ring-less getter of the present invention has a simplified structureand can be bonded onto a glass substrate merely by irradiating the laserbeam onto the ring-less getter. Accordingly, the mounting work can besimplified and automated easily.

According to the present invention, since the ring-less getter can bebonded to a glass substrate, the degree of freedom becomes larger when aring-less getter is disposed. For example, the ring-less getter can bebonded onto metallization (an electrode wiring conductor) such as ananode wiring conductor.

In the present invention, both the ring-less getter and the glasssubstrate are once fused and solidified, the ring-less getter can berigidly securely bonded onto the glass substrate.

Moreover, since the fritted glass is not used to bond the ring-lessgetter, it can be avoided that gases produced from the fritted-glassduring the flushing of the ring-less getter block the electron emissionof an electron source such as a filament.

According to the present invention, the laser beam bonds the ring-lessgetter onto the glass substrate and flushes the ring-less getter.Therefore, by merely changing the laser beam illumination conditions,the same laser beam illuminator can be shared for the mounting andflushing of a ring-less getter.

Moreover, the ring-less getter, which is made through merelypress-molding the getter material powder, has its simple structure andcan be fabricated easily and inexpensively. Moreover, the ring-lessgetter can be molded in a given shape and hence can be fabricated in theshape corresponding to a dead space in the electron device. Accordingly,a combination of ring-less getters different in shape enableseffectively using dead spaces in the electron device.

Moreover, the press-molded ring-less getter can be set to a giventhickness. Therefore, the ring-less getter formed of a getter materialenough to adsorb the residual gases can be mounted in the electrondevice.

1. A method of fixing a ring-less getter, comprising the steps of:disposing a ring-less getter on a glass substrate in an electron device,wherein a surface of said ring-less getter is in direct contact withsaid glass substrate; irradiating an optical energy onto said ring-lessgetter from a surface of said glass substrate, opposite to a surface ofsaid glass substrate on which said ring-less getter is disposed; fusingthe contacting surfaces of said ring-less getter and glass substrate bysaid optical energy; and bonding said ring-less getter on said glasssubstrate by cooling the fused contacting surfaces of said ring-lessgetter and glass substrate.
 2. The method defined in claim 1, whereinsaid optical energy is a laser beam.
 3. The method defined in claim 2,wherein said laser beam is illuminated through one of a laser markersystem and a dot spot system.
 4. The method defined in claim 2, whereinsaid laser is one of: a YAG laser, an excimer laser, and a carbondioxide laser.
 5. The method defined in claim 1, wherein said ring-lessgetter is formed of a mixture of at least two of: BaAl₄, MgAl, Ni, Ti,and Fe.
 6. The method defined in claim 1, wherein said glass substrateis one of: an anode substrate, a front substrate, a side plate, and agrid holding intermediate substrate.
 7. The method defined in claim 1,wherein said electron device is one of: a vacuum fluorescent display, afield emission fluorescent display, a fluorescent print head, a plasmadisplay panel, an electroluminescent display, and a cathode ray tube. 8.A method for activating a ring-less getter, comprising the steps of:disposing a ring-less getter on a glass substrate in an electron device;wherein a surface of said ring-less getter is in direct contact withsaid glass substrate; irradiating an optical energy onto said ring-lessgetter from a surface of said glass substrate, opposite to a surface ofsaid glass substrate on which said ring-less getter is disposed; fusingthe contacting surfaces of said ring-less getter and glass substrate bysaid optical energy; bonding said ring-less getter on said glasssubstrate by cooling the fused contacting surfaces of said ring-lessgetter and glass substrate; and irradiating an optical energy on asurface of said ring-less getter opposing the fused contacting surfacesto activate said ring-less getter.
 9. The method defined in claim 8,wherein said optical energy is a laser beam.
 10. The method defined inclaim 9, wherein said laser beam is illuminated through one of a lasermarker system and a dot spot system.
 11. The method defined in claim 9,wherein said laser is one of: a YAG laser, an excimer laser, and acarbon dioxide laser.
 12. The method defined in claim 8, wherein saidring-less getter is formed of a mixture of at least two of: BaAl₄, MgAl,Ni, Ti, and Fe.
 13. The method defined in claim 8, wherein said glasssubstrate is one of: an anode substrate, a front substrate, a sideplate, and a grid holding intermediate substrate.
 14. The method definedin claim 8, wherein said electron device is one of: a vacuum fluorescentdisplay, a field emission fluorescent display, a plasma display panel,an electroluminescent display, and a cathode ray tube.
 15. An electrondevice comprising: a hermetic container formed with a glass substrate;and a ring-less getter disposed in said hermetic container; wherein asurface of said ring-less getter is in direct contact with said glasssubstrate; said ring-less getter being fused onto said glass substrateby irradiating a laser beam on the contacting surfaces of said ring-lessgetter and said glass substrate from a surface of said glass substrateopposite to the surface of said glass substrate on which said ring-lessgetter is disposed.
 16. The electron tube defined in claim 15, whereinsaid hermetic container is formed with an anode substrate and a frontsubstrate.
 17. The electron tube defined in claim 16, wherein saidring-less getter is bonded onto said anode substrate.
 18. The electrontube defined in claim 16, wherein said ring-less getter is bonded ontosaid front substrate.
 19. The electron tube defined in claim 16, whereina plurality of ring-less getters are bonded onto said anode substrate.20. The electron tube defined in claim 16, wherein said hermeticcontainer further includes a side plate; wherein said ring-less getteris bonded onto said side plate.